Plan to participate in TIA’s annual strategic Conference, October 7-10, 2013 in Washington, DC.
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TIA Applauds Administration’s Investment in U.S. Manufacturing Innovation
FOR IMMEDIATE RELEASE
TIA CONTACT: EILEEN BRAMLET, TIA, +1.703.907.7749, ebramlet@tiaonline.org
PR CONTACT: ASHLEY ROOK, RATIONAL 360, +1.202.429.4929, ashleyrook@rational360.com
TIA Applauds Administration’s Investment in U.S. Manufacturing Innovation
ARLINGTON, VA (August 16, 2012) – The Telecommunications Industry Association (TIA), the leading association representing the manufacturers and suppliers of high-tech communications networks, applauds the Administration’s investment in the National Additive Manufacturing Institute partnership to promote manufacturing innovation in the United States.
Public-private partnerships and direct federal investment are important aspects of the U.S. innovation ecosystem that will help guarantee that the technology jobs of the future remain in the U.S. In the ICT sector, we continue to witness innovation becoming increasingly important for the health of national economies and the jobs that follow (see TIA Report: The Contributions of ICT to American Growth, Productivity, Jobs and Prosperity). As other countries take strong steps to build innovation-based economies, it is critical that the U.S. government recommit itself to provide the resources needed to fuel innovation.
About TIA
The Telecommunications Industry Association (TIA) represents manufacturers and suppliers of global communications networks through standards development, policy and advocacy, business opportunities, market intelligence, and events and networking. TIA enhances the business environment for broadband, mobile wireless, information technology, networks, cable, satellite and unified communications. Members' products and services empower communications in every industry and market, including healthcare, education, security, public safety, transportation, government, the military, the environment, and entertainment. Visit tiaonline.org for more details.
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