Plan to participate in TIA’s annual strategic Conference, October 7-10, 2013 in Washington, DC.
Longtime ICT Industry Engineer Herb Congdon Joins TIA as Associate Vice President of Technology and Standards
Arlington, Va. -- Herb Congdon, Campaign and Systems Marketing Manager for TE Connectivity (formerly Tyco Electronics), is joining the staff of the Telecommunications Industry Association as TIA's Associate Vice President of Technology and Standards on July 25.
Congdon has served on TIA engineering committees, TIA marketing sections and other industry standards committees and has a proven track record of results in 15 years of participation in multiple leadership positions (Chair, Vice-chair, Secretary, Editor) in TIA TR-42, User Premises Telecommunications Cabling Infrastructure. He served as Chair of TR-42, as well as subcommittees TR-42.1 Commercial Building Telecommunications Cabling (568-B.1) and TR-42.8 Telecommunications Optical Fiber Cabling Systems (568-B.3).
"As a volunteer on TIA's engineering committees, Herb has provided dynamic leadership for many years, helping to guide TIA's standards development efforts and growing markets for the industry," said TIA President Grant Seiffert. "We welcome him aboard, fortunate that we can now take advantage of his deep industry knowledge fulltime."
Congdon has been elected President, Treasurer and Secretary of the Professional Engineers of North Carolina and is currently the Past-President.
A subject matter expert in telecommunications technologies, Herb has been a featured presenter on a wide variety of market, industry and technical topics for TIA, the Building Industry Consulting Service International (BICSI), the Association for Information Communications Technology Professionals in Higher Education (ACUTA), the FOSE Conference and Exposition (a military/defense trade show), International Wire & Cable Symposium (IWCS) and others. He has written many market-focused documents including published articles, white papers, training modules and podcasts. Recently, he was awarded the Harry J. Pfister Award for Excellence in the Telecommunications Industry by BICSI and the University of South Florida, College of Engineering.
Prior to working at TE Connectivity, Congdon worked as an engineer and product specialist at Siecor Corporation (now Corning Cable Systems). He has served as project manager for over 20 large-scale projects including federal government and healthcare marketing campaigns.
Congdon is a licensed Professional Engineer and a veteran of the U.S. Navy's nuclear submarine program where he served with distinction as a commissioned Nuclear Engineering Officer and Squadron Operations Officer.
About TIA
The Telecommunications Industry Association (TIA) represents the global information and communications technology (ICT) industry through standards development, advocacy, business opportunities, market intelligence and networking. Since 1924, TIA has been enhancing the business environment for broadband, mobile wireless, information technology, networks, cable, satellite and unified communications. Members' products and services empower communications in every industry and market, including healthcare, education, security, public safety, transportation, government, the military, the environment and entertainment.
TIA's 2011 Market Review & Forecast, is available for purchase online at the TIA store. TIA members receive a discount of more than 60 percent off of the cover price. Review copies are available for qualified media.
View video news programming on TIA Now at http://www.tianow.org.
TIA is accredited by the American National Standards Institute (ANSI). Visit tiaonline.org.
TIA's Board of Directors includes senior-level executives from ADTRAN, Alcatel-Lucent, ANDA Networks, AttivaCorp, Cisco Systems, Dow Chemical Company, Ericsson, Inc., GENBAND, Inc., Henkels & McCoy, Juniper Networks, ILS Technology, Intel Corporation, Intersect, Inc., LGE, Microsoft, Motorola, Nokia Siemens Networks, OneChip Photonics, Panasonic Computer Solutions Co., Qualcomm, Research In Motion, Sumitomo Electric Lightwave Corporation, Tellabs, TE Connectivity, Ulticom, Inc., Walker & Associates and WirefreeCom, Inc. Advisors to the Board include FAL Associates and Telcordia Technologies.
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We hope that China will use this break in the negotiations to reexamine its approach to the negotiations to expand the ITA and focus on reducing its overly large list of sensitive products. If China is ready to move forward to conclude the expansion of the ITA this year then the ITA Expansion is achievable this year.

As part of a large U.S. industry delegation representing a broad array of ICT manufacturers, TIA is in Geneva, Switzerland this week to cheer on the trade negotiators who are working hard to conclude the negotiations to expand the product coverage of the WTO’s Information Technology Agreement (ITA). The ITA remains one of the most commercially important WTO trade agreements – by eliminating tariffs on a broad range of ICT products, the ITA lowers the cost and improves access to these products, which are vital to the economic competitiveness of all economies around the world.
The Telecommunications Industry Association was in Geneva last week along with AdvaMed, the Consumer Electronics Association, the Entertainment Software Association, the Information Technology Industry Council, the Liquid Crystal Polymer Coalition, the Motion Picture Association of America, and the Semiconductor Industry Association. This coalition of high-tech companies represents a broad spectrum of manufacturers and service providers in the information and communication technology (ICT) sector.
Last week was a busy one at the World Trade Organization (WTO) in Geneva, Switzerland. The signs are very encouraging that the member countries of the WTO are back on track to move the WTO’s trade liberalization agenda forward – from the new International Services Agreement (ISA) to the ongoing negotiations to expand the existing WTO Information Technology Agreement (ITA).






